CIRP 2010 - 2nd PMI International Conference

Schedule

IMPORTANT DATES
Abstracts Due	March 1, 2010
Papers Due	March 20, 2010
Reviewed paper returned to author	April 30, 2010
Final paper submission	May 15, 2010

Tentative Conference Schedule

June 10, 2010 (Thursday)

08:00	Registration

09:00	Welcome and Introduction Prof. Y. Altintas

09:10	Process Machine Interaction Conference History Prof. B. Denkena

09:30	Key Note Paper: Process Machine Interaction Prof. C. Brecher

10:20	Coffee Break

10:40-12:10	Paper Sessions (20 minutes/paper)

12:10-13:30	Lunch (Will be provided at the conference site as an open buffet with various selections including vegetarian food)

13:30-15:30	Paper Sessions

15:30-16:00	Coffee Break

16:00-17:30	Industry Presentations

18:30-23:00	Conference Dinner at Cecil Green Park . Cecil Green Park overlooks at sea, islands and mountains from its dining area opening to magnificent garden. Salmon BBQ and variety of vegetables, fruits, deserts and drinks will be served. Cecil Green Park is walking distance away from the conference site, university hotel, and main bus station of the university.

June 11, 2010 (Friday)

08:30 -10:10	Paper Sessions

10:10- 10:30	Coffee Break

10:30- 12:10	Paper Sessions

12:10-13:30	Lunch (Lunch buffet will be provided)

13:30-15:30	Paper Sessions

15:30-16:00	Coffee Break

16:00-17:30	Industry Presentations

17:30	Farewell and closure

Paper and Industry Presentations

Paper Sessions: We are encouraging colleagues from academia and industry to offer articles in the following major topics. Papers which are relevant to any aspect of high speed machining are also welcome.

Papers will be peer reviewed in accordance with CIRP regulations.

Industry Sessions: Significant participation is expected from machine tool, die & mold, metal forming, cutting tool, CNC, CAD/CAM, Sensors and measurement equipment suppliers as well as end users from industry. Suppliers will have a chance to display their products using brochures, posters and computers in an exhibition room equipped with booths. Invited speakers from major suppliers and end users in aerospace, automotive and die-mold industry will give presentations with optional paper submissions.